CAREER: Privacy-preserving Transfer Learning for Process-defect Modeling toward Accelerated Cross-system Certification for Metal Additive Manufacturing

NSF Award Search · 01002122DB NSF RESEARCH & RELATED ACTIVIT · $515,651 · view on nsf.gov ↗

Abstract

The process-defect relationship is one of the key elements to the certification of additive manufacturing (AM) parts, which has been a major challenge in accelerating AM technology deployments in the industry. Advanced machine learning methods that leverage massive data to characterize the process-defect relationship have been studied for AM certifications. However, some AM fabrications and certification courses, especially for high-valued metallic parts, are lengthy and costly; thus, if the certification could be transferrable between different AM systems, it may greatly broaden the industrial use of AM technologies. Though feasible in theory, combining data from multiple AM systems on a shared platform for the certification purpose is not practical because of the desire to protect intellectual properties and sensitive data. What is lacking, therefore, is a holistic strategy to share knowledge learned from different AM systems without compromising the private information. This Faculty Early Career Development (CAREER) award supports fundamental research on privacy-preserving AM process-defect modeling and certification means across different systems. The project aims to establish a transfer learning groundwork, while protecting the process and part confidentiality, to understand and establish the process-defect relationship in metal AM between different systems. In addition, educational activities closely integrated with the research will provide basic training in privacy-pr

Key facts

NSF award ID
2600066
Awardee
Oklahoma State University (OK)
SAM.gov UEI
NNYDFK5FTSX9
PI
Wenmeng Tian
Primary program
01002122DB NSF RESEARCH & RELATED ACTIVIT
All programs
CAREER-Faculty Erly Career Dev, RESEARCH EXP FOR UNDERGRADS, Advanced Manufacturing, WOMEN, MINORITY, DISABLED, NEC, EXP PROG TO STIM COMP RES, UNDERGRADUATE EDUCATION, SUPPL FOR UNDERGRAD RES ASSIST, REU SUPP-Res Exp for Ugrd Supp
Estimated total
$515,651
Funds obligated
$244,833
Transaction type
Standard Grant
Period
10/01/2025 → 04/30/2027